Thermal Grizzly Minus Pad 8 High Performance Thermal Pad - 30x30x2.0mm
5 sold in last 24 hours
- TG-MP8-30-30-20-1R
- Minus Pad series consist of a very elastic and flexible surface area with very high thermal conductivity, compensating
- face area with very high thermal conductivity, compensating for even the smallest of gaps between components. Available in a variety of different sizes and thicknesses. The easy to process and flexibl
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Select a product to estimate shipping.Looking to improve the cooling performance of your computer components? The Thermal Grizzly Minus Pad 8 is a high-performance thermal pad designed for optimal heat transfer. Its flexible and elastic design helps fill gaps between components, ensuring efficient heat dissipation.
Key Highlights
- Effective Heat Transfer: Utilizes ceramic silicon compound with aluminum oxide nanoparticles for superior thermal conductivity.
- Gap Filling: The flexible surface effectively compensates for small gaps between components, maximizing contact area.
- Easy Application: Features a sticker mount for simple and quick installation.
- Versatile Size: Available in various sizes to suit different cooler and heatsink configurations.
- Lightweight: Weighing only 9g, it won't add significant bulk to your build.
Useful Facts
- Brand: Thermal Grizzly
- Material: Ceramic Silicon Compound with Aluminum Oxide Nanoparticles
- Weight: 9 g
- Mounting: Sticker Mount
- Quantity: 1 Pad
Good Fit For
- PC Gaming Builds
- High-Performance Desktop Computers
- CPU and GPU Cooling
- Small Form Factor (SFF) Builds
| Main Specification | |
|---|---|
| Výrobce | Thermal Grizzly |
| Počet jednotek | 1. 0 Počet |
| Značka | Thermal Grizzly |
| UPC | 753677507395 |
| Počet položek | 1 |
| Identifikační číslo globálního obchodu | 00753677507395 |
| Typ montáže | Sticker Mount |
| Hmotnost položky | 9 g |
| Product information | |
| Počet balení | 1 |
| Technical Details | |
| Číslo části | TG-MP8-30-30-20-1R-2 |
| Země původu | Čína |
| Item details | |
| Vzorové číslo | TG-MP8-30-30-20-1R-2 |
| Others | |
| Typ výrobku | Termální desky |
| Čisté množství | 1. 0 Počet |
| Chladič Heatsink Materiál | Ceramic Silicon Compound with Aluminum Oxide Nanoparticles |